发明名称 |
ELECTRONIC CIRCUIT DEVICE |
摘要 |
PURPOSE: To provide an electronic circuit device which can readily be detached without adversely affecting surface mounting parts in a structure in which a plurality of sheets of circuit substrate are superimposed each other. CONSTITUTION: When a plurality of sheets of circuit substrate are stacked by forming a structure in which one side is joined with solders and the other side is joined with conductive adhesives by use of a metal piece as a spacer, it is possible to easily separate connection points and facilitate rework of parts interposed between circuit substrates. |
申请公布号 |
KR20010092350(A) |
申请公布日期 |
2001.10.24 |
申请号 |
KR20010013318 |
申请日期 |
2001.03.15 |
申请人 |
SONY CORPORATION |
发明人 |
IMAI YOSHIHIKO;MURAYAMA TOSHIHIRO;TATSUNO YASUFUMI |
分类号 |
H05K1/14;H05K3/32;H05K3/34;H05K3/36;H05K3/40;(IPC1-7):H05K3/36 |
主分类号 |
H05K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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