Self-aligned unlanded via metallization,申请号GB19970006081-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	Self-aligned unlanded via metallization
摘要
申请公布号	GB2323704(B)	申请公布日期	2001.10.24
申请号	GB19970006081	申请日期	1997.03.24
申请人	* UNITED MICROELECTRONICS, CORP.	发明人	SHIH-WEI * SUN
分类号	H01L21/768;(IPC1-7):H01L21/768	主分类号	H01L21/768
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Exhaust for clothes driers

Automatic trip for two-way plow

Cornpicker roll

Figure toy with spinning element

Tungsten-chromium-alumina metal ceramics

Robe with fasteners

INVESTMENT COMPOSITIONS AND METHOD OF PRODUCING REFRACTORY MOLDS THEREFROM

CURRENT TRANSFORMERS

OUTPUT COUPLING CIRCUIT FOR A BALANCED HIGH FREQUENCY GENERATOR

MEANS OF PRE-EXCITING OSCILLATION GENERATORS

GLOW DISCHARGE DEVICES

SHOEMAKING APPARATUS

FINISH CHECK INSPECTOR

INTERNAL COMBUSTION ENGINE POWER PLANTS

MACHINES FOR TREATING WOOD SURFACES

WINDING ARRANGEMENT FOR VARIABLE TRANSFORMER

PERFECCIONAMIENTOS INTRODUCIDOS EN LAS INSTALACIONES DE SANEAMIENTO