| 摘要 |
PURPOSE: To provide heating treatment equipment which is used for the heat treatment of the substrate of a liquid crystal display device or a semiconductor substrate carrying a resist film formed on its surface and prevents the occurrence of transfer to the substrate. CONSTITUTION: This heating treatment equipment 52 is provided with a heating plate 42 which performs heat treatment on a substrate G positioned closely to or placed on the placing surface of the plate 42. On the placing surface of the plate 42, elevating/lowering pins 48 which elevate/lower the substrate G are set so that the pins 42 may pass through the plate 42. Each pin 48 is formed in such a way that the outer diameter of its front end section is made smaller than that of its body section.
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