Mounting a heat-dissipating device

摘要

A number of posts 22 are formed on an underside of a cover 2 of a heat-dissipating device 1. The posts are extended through positioning holes 11 on a base of the heat-dissipating device. The posts may have snap fasteners 23 that are extended through positioning holes 31 in a circuit board 3 on which a heat-generating element 32 is mounted. Alternatively, each post is extended through an engaging member (55) that has an engaging peg (552) projected therefrom (fig 7). Each engaging peg has a snap fastener (553) for engaging with an associated positioning hole of the circuit board. An elastic element 24 is sleeved around each post or each engaging peg, thereby providing the snap fastener with reliable snapping effect. Thus, the base of the heat-dissipating device and the heat-generating element are in intimate contact with each other to obtain excellent heat conduction therebetween.