| 摘要 |
Wafer polishing apparatus (Fig 1) comprises an index unit (2, having wafer-storing cassettes 21 and a robot 22), a load/unload unit (3, with wafer transfer robots 31, 32), a washing unit (5), an electrical installation unit (6) and a polishing unit (4, which includes platens 41, a dresser 44 for condition regulation of platen-mounted polish cloths, and two polishing heads 42 which can be linearly moved between platens). Dresser 44 includes an idly supported grinding wheel head 444 (which is capable of vertical movement relative to its main body 441 via arm (45, Fig 2) and rotation via drive shaft 442) and a pushing means such as a rubber/resin air bag 449 (interposed between body 441 and head 444). Air pressure inside air bag 449 can be regulated (via supply through passage 450) so as to control the force pushing head 444 against the polishing cloth. Head-washing tank (46, Fig 4, with a detachably mounted brush(table) 462, 463 ) is positioned next to platen (41). Polishing involves the transfer of a wafer (10) from cassettes (21) to (un)load unit (3) and on to polishing unit (4). Wafer (10) is held by heads (42) after polishing by platens on both sides and then transferred, via waiting unit (43), to the centre platen which has different polishing characteristics. After polishing, (un)load unit (3) transfers wafer (10) to washing unit (5) before returning it cassette (21) via robot (22). |
