| 摘要 |
PURPOSE: A substrate processing method and a substrate processing apparatus are provided to capable of uniformly performing predetermined processing with a solution on a substrate, make each line width be uniform in developing processing and prevent defects from occurring during the coating of the developing solution. CONSTITUTION: On the occasion of developing processing, a mixed solution produced by stirring a developing solution and a solution with a specific gravity smaller than the developing solution is supplied to the front surface of a substrate and left as it is for a fixed period of time. After the mixed solution is separated into two layers of which the lower layer is the developing solution and the upper layer is the solution, developing progresses all at once in the entire surface of the substrate. Hence, time difference in start time of developing does not occur in the surface of the substrate, thereby enabling uniform developing and an improvement in line width uniformity of a resist pattern film in the surface of the substrate.
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