| 摘要 |
A lead frame (1) is provided which includes elongated side frames (2, 3) extending in parallel to each other, and section bars (4) connecting the side frames in a manner allowing the side frames to be shifted longitudinally. The side frame (2) is integrally formed with first lead terminals (6), whereas the side frame (3) is integrally formed with second lead terminals (7). Extremities of the first and the second lead terminals are overlapped after the side frames (2, 3) are shifted. At least either one of the first lead terminal (6) and the second lead terminal (7) is formed with a weaker portion having reduced bending strength. The extremities of the first and the second lead terminals is bonded to a semiconductor element (T) after the side frames (2, 3) are shifted. Thereafter, restoring force due to the spring-back action of the section bars (4) acts on the lead terminals (6, 7) and the semiconductor element (T). However, the restoring force is used to deform the weaker portion.
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