发明名称 |
Thermal conductive silicone rubber compositions and making method |
摘要 |
An organopolysiloxane, a hydrolyzable group-bearing methylpolysiloxane, a thermal conductive filler, and a curing agent are blended to form a silicone rubber composition which is minimized in viscosity or plasticity increase and remains effectively moldable and workable even when loaded with a large amount of the thermal conductive filler. It cures into a silicone rubber part having a high thermal conductivity.
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申请公布号 |
US6306957(B1) |
申请公布日期 |
2001.10.23 |
申请号 |
US20000521776 |
申请日期 |
2000.03.09 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
NAKANO AKIO;TAKEI HIROSHI;HASHIMOTO TAKESHI;SAKURAI YUUKI |
分类号 |
C08K3/00;C08L83/04;C08L83/06;(IPC1-7):C08K3/10 |
主分类号 |
C08K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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