| 摘要 |
PURPOSE: To provide substrates suitable for the manufacture and product of a thin-film semiconductor device. CONSTITUTION: A substrate 20 for manufacture with characteristics, capable of resisting of a process for forming a thin-film resistor 3 and a substrate 1 for the product with characteristics suitable for directly loading the thin-film transistor 3 are prepared in a preparation process. Next, the substrate 20 for manufacture is adhered to the substrate 1 for the product, so that the substrate 1 for the product can be supported from the back side in an adhering process. Then, at least the thin-film transistor 3 is formed on the surface of the substrate 1 for the product in a state that this is reinforced by the substrate 20 for manufactured. At least, the substrate 20 for manufacturing which is already used is isolated from the substrate 1 for the product in an isolating process.
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