发明名称 |
Tape under frame for conventional-type IC package assembly |
摘要 |
A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead fingers. The semiconductor die is attached to the tape so that it may be wire bonded to the lead fingers. The tape contains at least one slot to allow for expansion and/or contraction of the tape due to various temperatures experienced during the manufacturing process so that the tape does not wrinkle or warp to alter the position of the die.
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申请公布号 |
US6306687(B1) |
申请公布日期 |
2001.10.23 |
申请号 |
US20000548571 |
申请日期 |
2000.04.13 |
申请人 |
CORISIS DAVID J.;KINSMAN LARRY D.;BROOKS JERRY M. |
发明人 |
CORISIS DAVID J.;KINSMAN LARRY D.;BROOKS JERRY M. |
分类号 |
H01L23/495;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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