| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a wafer holding ceramic member adequate for a conveying/holding member of a semiconductor wafer, an LCD glass substrate, a magnetic disk substrate and the like. SOLUTION: In this manufacturing method of the wafer holding ceramic member, a projection is formed at a predetermined position of a ceramic substrate by a sandblast machining method, and the edge of the tip of the projection is finished like curved surface. The edge of the tip of the projection is polished using a brush holding abrasive grains on the surface or inside the bristles to be finished like curved surface. |
