| 摘要 |
PROBLEM TO BE SOLVED: To reduce the number of occurrences of bridging due to the collapse of paste during mounting parts and also the number of occurrences of a short during reflow by adjusting the collapse amount of a pastelike printing agent by the parts during mounting, and ensure the secure reliability to join the parts and a circuit substrate together during mounting. SOLUTION: This screen process printing method is to print the pastelike printing agent, through a screen mask, on the electrodes of the substrate whose electrodes are adjacently spaced from each other as ones on which the parts are to be mounted, and is such a method by which the printing agent on the electrodes is printed so that its amount is reduced. In positive terms, the method is to print the printing agent in a smaller area than spots, for the electrodes of the substrate, where the agent is to be printed.
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