| 摘要 |
A method and apparatus that provides a dechucking voltage applied to an electrostatic chuck that facilitates removal of a workpiece or workpiece therefrom. The method incorporates residual chucking force information obtained from the preceding dechuck operation to modify and improve the dechucking algorithm for the subsequent wafer dechucking cycle. To avoid charge accumulation on the electrostatic chuck when processing a succession of workpieces, the chucking and dechucking voltages reverse polarity after each workpiece is dechucked.
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