FLIP CHIP BONDER OF AUTOMATIC PARALLEL ALIGNMENT TYPE

摘要

PURPOSE: A flip chip bonder of an automatic particle alignment type is provided to adhere two semiconductor chips to each other by maintaining automatically parallelism of surfaces of the semiconductor chips. CONSTITUTION: An upper chip holder(4) is fixed to an upper supporter(2). A lower chip holder(5) is fixed to a lower supporter(7). An upper chip and a lower chip are adsorbed to the upper chip holder(4) and the lower chip holder(5), respectively. The upper supporter(2) is fixed to a frame(3) by a fixing device such as a clamp. A passing hole is formed in a center portion of the upper supporter(2). A perspective window is inserted into an upper portion of the upper chip holder(4). An airtight space is formed between the upper chip holder(4) and the perspective window. The airtight space is connected with the first vacuum hose(14) and the first vacuum valve(16). The upper chip is fixed to the upper chip holder(4) by a vacuum pump connected with the first vacuum hose(14). The lower supporter(7) includes a pressure chamber and a metal grating layer. An inner vacuum hose(6) is connected with a lower side hole of the lower chip holder(5). The inner vacuum hose(6) is connected with a lower vacuum absorption hole through the second vacuum hose(15) and the second vacuum valve(17). The lower supporter(7) is fixed on a location controller including three-axis linear mobile stage(9,10,11) and a rotary stage(8). The location controller is operated accurately by an external computer(20), a joystick(19), and a monitor(21).