| 发明名称 |
Semiconductor device and method for fabricating the same |
| 摘要 |
In a method, first and second circuit elements are provided on a surface of a semiconductor substrate; and a hole is formed in the semiconductor substrate between the first and second circuit elements. Then, the semiconductor substrate is divided at the hole to separate the first and second circuit elements from each other.
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| 申请公布号 |
US6306731(B1) |
申请公布日期 |
2001.10.23 |
| 申请号 |
US20000541429 |
申请日期 |
2000.04.03 |
| 申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
IGARASHI TADASHI;TSUKUDA AKINORI |
| 分类号 |
H01L23/52;H01L21/301;H01L21/3205;H01L21/52;H01L21/60;H01L21/768;H01L21/78;H01L23/48;H01L23/485;(IPC1-7):H01L21/46 |
主分类号 |
H01L23/52 |
| 代理机构 |
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代理人 |
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