发明名称 METHOD FOR FORMING CONTACT PLUG OF SEMICONDUCTOR DEVICE
摘要 PURPOSE: A contact plug formation is provided to prevent an etching failure of the contact plug and to improve a stability of stress by forming an etch resisting spacer at inner sidewalls of a contact hole. CONSTITUTION: An interlayer dielectric(110) is formed on the semiconductor substrate(100). A contact hole is formed by selectively etching the interlayer dielectric(110). An etch resisting spacer(120a) is formed at inner sidewalls of the contact hole. A contact plug(134a) is formed by filling a conductive layer into the contact hole. The etch resisting spacer(120a) has a low etching selectivity compared to the contact plug(134a).
申请公布号 KR20010091536(A) 申请公布日期 2001.10.23
申请号 KR20000013350 申请日期 2000.03.16
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, GIL HYEON;KIM, BYEONG HUI;LEE, JONG MYEONG;LIM, HYEON SEOK
分类号 H01L21/283;(IPC1-7):H01L21/283 主分类号 H01L21/283
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