发明名称 ELECTROMOTIVE MOLD CLAMPING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electromotive mold clamping device having a novel structure capable of reconciling a high mold on-off speed and large mold clamping force to obtain high energy efficiency while suppressing an increase in the total length of the device. SOLUTION: A plurality of electromotive actuators 22, 22 are arranged to a movable platen 16 at a position shifted outwardly from the center axis of the movable platen 16 and the outputs of the actuators 22, 22 are transmitted to the movable platen 16 through a toggle type booster mechanism 20 to perform mold opening-closing operation and mold clamping operation.
申请公布号 JP2001293726(A) 申请公布日期 2001.10.23
申请号 JP20000112657 申请日期 2000.04.13
申请人 MEIKI CO LTD 发明人 MORITA RYOZO
分类号 B29C33/22;B29C45/66;(IPC1-7):B29C33/22 主分类号 B29C33/22
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