| 摘要 |
PURPOSE: An apparatus for absorbing a solder ball is provided to load correctly solder balls used in one package by transferring one solder ball to one passing hole. CONSTITUTION: A vacuum room(23) a passing holes(21) are formed in a solder ball absorbing device(20). The number of passing holes(21) corresponds to the number of solder balls. A hollow rod(22) is shifted to an upper and a lower direction of the passing hole(21). The hollow rod(22) is inserted into an absorbing plate of the solder ball absorbing device(20). A diameter of the passing hole(21) is larger than that of the solder ball. A solder ball is adsorbed to the hollow rod(22) in the vacuum room(23) of a vacuum state. The hollow rod(22) is shifted to a rear direction. The air is injected to the vacuum room(23) and the solder ball is unloaded from the hollow rod(22) by the injected air. The solder ball is loaded on a package.
|
