METHOD FOR SEPARATING WAFER IN SEMICONDUCTOR MANUFACTURING SINGLE WAFER EQUIPMENT

摘要

PURPOSE: A method for separating a wafer in semiconductor manufacturing equipment is provided to prevent pollution from rear parts of a susceptor and a wafer when a wafer is separated from a susceptor in the semiconductor manufacturing equipment including a vacuum ring and a nitrogen injection ring. CONSTITUTION: A wafer is adhered to a susceptor by using vacuum of a vacuum ring(31) if a deposition process is started(101). The surface pollution of the susceptor is prevented by maintaining flow of nitrogen injected from a nitrogen injection ring(33) to an exhaust direction during the deposition process(103). A pressure of the nitrogen gas injected from the nitrogen injection ring(33) is increased if the deposition process is finished. The wafer is separated from the susceptor by the increased pressure of the nitrogen gas(105).