| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in moldability, flame retardancy and solder crack resistance. SOLUTION: This epoxy resin composition for sealing semiconductors is characterized in that the composition comprises (A) an epoxy resin represented by general formula (1), (B) a modified phenol resin obtained by carrying out polycondensation of petroleous heavy oil or pitches, formaldehyde polymer and phenols in the presence of an acid catalyst, (C) an inorganic filler and (D) a curing accelerator as essential components, where the melting point of the epoxy resin (A) is 60-120 deg.C.
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