发明名称 |
AQUEOUS DISPERSION FOR FORMING LOW-DIELECTRIC CONSTANT INSULATION FILM, THE RESULTANT LOW-DIELECTRIC CONSTANT INSULATION FILM, AND ELECTRONIC COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To provide an aqueous dispersion for forming a low dielectric constant insulator film capable of forming organic insulation film by electrodeposition, to provide the low-dielectric constant insulation film obtained from the above aqueous dispersion, and to provide electronic components each having the above low-dielectric constant insulation film. SOLUTION: This aqueous dispersion for forming a low-dielectric constant insulation film is such that film-nonforming microparticles <=1μm in average size and <=3 in dielectric constant and organic particles consisting of a polymerizable compound and/or a polymer are dispersed in an aqueous medium, and is characterized by being capable of forming insulation film by electrodeposition; wherein the film-nonforming microparticles are preferably fluorine-containing microparticles and/or crosslinked organic microparticles, and the organic particles preferably have electric charge on the surface and consist of a polyimide-based resin. The 2nd objective low-dielectric constant insulation film to be formed the above aqueous dispersion by electrodeposition is characterized by being <=3 in dielectric constant. The other objective electronic components are characterized by being provided respectively with the above low- dielectric constant insulation films.
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申请公布号 |
JP2001294815(A) |
申请公布日期 |
2001.10.23 |
申请号 |
JP20000112668 |
申请日期 |
2000.04.13 |
申请人 |
JSR CORP |
发明人 |
GOTO HIROFUMI;ITO NOBUYUKI |
分类号 |
C08J3/07;C09D5/25;C09D5/44;C09D201/00;H01L21/312;H01L21/768;H01L23/522;(IPC1-7):C09D201/00 |
主分类号 |
C08J3/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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