| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition giving a hardened material excellent in flexibility, thermal resistance for soldering, resistance to thermal deterioration, and durability in electroless metal plating, capable of being developed with an organic solvent or a dilute alkaline solution, suitable for a solder resist and a layer insulation. SOLUTION: This resin composition comprises (A) an oligomer including a specific carboxylic group and (B) a diluent.
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