| 摘要 |
PURPOSE: A heat-sink structure of a DSP(Digital Signal Processor) chip is provided to lengthen a life time of a DSP chip by minimizing a thermal load of a DSP chip installed in an airtight structure or an airtight space. CONSTITUTION: A thermal conductive rubber(23) is adhered to both sides of an assembly of a substrate(21) and a DSP chip(22). A body(24) is adhered to the thermal conductive rubber(23) of the DSP chip(22). The body(24) has prominent thermal conductivity. An upper cover(25) is adhered to the thermal conductive rubber(23) of the substrate(21). The upper cover(25) has prominent thermal conductivity. The substrate(21), the DSP chip(22), the thermal conductive rubber(23), the body(24), and the upper cover(25) are fixed to a casing. The body(24) is formed with a projection type in order to form space portions(24a,24b,24c) in a combining state.
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