发明名称 |
Semiconductor packaging metal lid |
摘要 |
A metal lid for use in hermetic sealing of a semiconductor package comprises a lid body comprising a metal plate having a solder layer secured to the entire surface of the metal lid by cladding. The lid is placed in position on a substrate and can seal the resulting package by heating to melt the solder layer. The lid can be readily mass-produced and can seal the package with high seal reliability and without deposition of solder balls on the inner wall of the package.
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申请公布号 |
US6306526(B1) |
申请公布日期 |
2001.10.23 |
申请号 |
US19990394798 |
申请日期 |
1999.09.10 |
申请人 |
SUMITOMO METAL (SMI) ELECTRONICS DEVICES INC.;SENJU METAL INDUSTRY CO. LTD. |
发明人 |
YAMAMOTO TETSUYA;KAWAMURA SHIGEKI;TANIGUCHI SANAE |
分类号 |
B23K35/22;B23K35/26;B32B15/01;C22C11/06;C22C11/08;C22C11/10;H01L23/02;H01L23/04;H01L23/10;(IPC1-7):B32B15/01 |
主分类号 |
B23K35/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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