| 摘要 |
A device and method for molding integrated circuit packages including a semiconductor integrated circuit chip and a lead frame with a plurality of leads is disclosed. The device is formed of top and bottom mold dies having intermating teeth that provide a sealed mold cavity around the integrated circuit chip and the lead frame leads. The teeth of at least one of said mold dies are formed with inclined surfaces that assist in compensating for any misalignment between the lead frame and the dies. |
