CHIP PACKAGE WITH INNER STRUCTURE FOR EFFECTIVE THERMAL TRANSFER

摘要

PURPOSE: To provide a principle of chip package structure for constituting a direct weld joint thermal path from a chip surface to a cover. CONSTITUTION: The position of the thermal path at a surface of a chip 1 is defined by a welding member. On the other hand, the thermal path position on the cover 7 is connected at a cover contact end made of good thermal transfer path member with low thermal impedance connection. The good thermal transfer path member 11 has a length enough for contacting chip connection end of the good thermal transfer path member 11 with a chip contact welding member 10 on the surface of the chip 1, when the cover 7 is held in position on the chip. The welding member 10 and the chip contact end 13 of the good thermal transfer path member 11 are welded by carrying out low-temperature excursion and dwell to offer low thermal impedance from a surface of the direct chip to the cover 7.