BAKING APPARATUS FOR MANUFACTURING SEMICONDUCTOR

摘要

PURPOSE: A baking apparatus is provided to easily achieve a uniformity of heat transferred to a photoresist film and to improve a processing margin of a photoresist pattern. CONSTITUTION: A semiconductor wafer(W) is loaded on a lower plate(32). The semiconductor wafer(W) includes a conductive pattern, an insulating layer and a photoresist film. An upper plate(34) includes a heating part(34a) for baking the photoresist film of the semiconductor wafer(W). The lower plate(32) and the upper plate(34) are located in a chamber(30). The upper plate(34) is formed on the upper part of the chamber(30).