发明名称 METHOD FOR MANUFACTURING SELF-ALIGNED CONTACT HOLES
摘要 PURPOSE: A fabrication method of an SAC(Self-Aligned Contact) holes is provided to improve an overlay margin by using a self-aligned contact formation method. CONSTITUTION: A plurality of gate patterns(300) are formed on a substrate(100). First insulating patterns(400) are coated in spaces between the gate patterns(300). A first contact hole is formed to expose the substrate by self-aligned etching the first insulating patterns. Spacers(600) are formed at both sidewalls of the first contact hole. After forming a first plug(710) filled into the first contact hole, the first plug(710) and the gate patterns(300) are partially etch backed, so that the spacers(600) are protruded. Then, a second plug(730) is formed by filling into the spaces between the protruded spacers. Capping protection patterns(650) are formed on the exposed gate patterns.
申请公布号 KR20010091085(A) 申请公布日期 2001.10.23
申请号 KR20000012427 申请日期 2000.03.13
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JI, GYEONG GU;NAM, BYEONG YUN
分类号 H01L21/28;H01L21/60;H01L21/768;(IPC1-7):H01L21/28 主分类号 H01L21/28
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