发明名称 |
METHOD FOR MANUFACTURING SELF-ALIGNED CONTACT HOLES |
摘要 |
PURPOSE: A fabrication method of an SAC(Self-Aligned Contact) holes is provided to improve an overlay margin by using a self-aligned contact formation method. CONSTITUTION: A plurality of gate patterns(300) are formed on a substrate(100). First insulating patterns(400) are coated in spaces between the gate patterns(300). A first contact hole is formed to expose the substrate by self-aligned etching the first insulating patterns. Spacers(600) are formed at both sidewalls of the first contact hole. After forming a first plug(710) filled into the first contact hole, the first plug(710) and the gate patterns(300) are partially etch backed, so that the spacers(600) are protruded. Then, a second plug(730) is formed by filling into the spaces between the protruded spacers. Capping protection patterns(650) are formed on the exposed gate patterns. |
申请公布号 |
KR20010091085(A) |
申请公布日期 |
2001.10.23 |
申请号 |
KR20000012427 |
申请日期 |
2000.03.13 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JI, GYEONG GU;NAM, BYEONG YUN |
分类号 |
H01L21/28;H01L21/60;H01L21/768;(IPC1-7):H01L21/28 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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