| 摘要 |
PURPOSE: A semiconductor wafer processing apparatus is provided to perform a series of thinning steps, ranging from mechanical grinding of a semiconductor wafer to removal of its damaged layer. CONSTITUTION: A semiconductor wafer processing apparatus grinds a surface of a semiconductor wafer by mechanical grinding, and then removes a damaged layer in the ground surface. In the processing apparatus, a grinding portion, a precenter portion, a wafer cleaning portion, plasma treatment portions, and magazines are arranged radially about an origin of a polar coordinate system of a third wafer transport portion having a robot mechanism, and their positions of arrangement are set such that the origin is located on lines of extension of wafer carry-in and carry-out center lines of the plasma treatment portions. Thus, the number of changed grippings of the semiconductor wafer can be minimized to prevent breakage of the semiconductor wafer. Moreover, transfer of the semiconductor wafer between the respective portions can be covered by the single robot mechanism, and the equipment can be made compact.
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