| 摘要 |
<p>PURPOSE: An electromagnetic valve manifold is provided, in which all or parts of electronic parts including integrated circuits for communication are carried on substrates in a state of bare chips, and the substrates are mounted on solenoid-operated valves or a manifold to reduce the volume of the solenoid-operated valve manifold so that the size is successfully miniaturized. CONSTITUTION: An electromagnetic valve manifold(10) comprises a plurality of solenoid-operated valves(16a to 16e) attached to a manifold(34), and a mediating unit(20) arranged adjacently side by side with the manifold. Substrates(24a to 24e) which carry electric parts including integrated circuits for communication, are mounted in each of recesses(26a to 26e) formed on outer surfaces of manifold blocks(12a to 12e) for constructing the manifold.</p> |
