发明名称 |
THROTTLE VALVE OF SINGLE WAFER SEMICONDUCTOR MANUFACTURING EQUIPMENT |
摘要 |
PURPOSE: A throttle valve of single wafer semiconductor manufacturing equipment is provided to minimize powder stacked on a seal by combining correctly the seal with a passing hole of a main body. CONSTITUTION: A throttle valve(50) has a hexahedral body(51). A circular groove portion(52) is formed on each center portion of an upper face and a lower face of the hexahedral body(51). A rectangular groove portion(53) is formed on each bottom face of the circular groove portion(52). A passing hole(54) is formed on a bottom face of the rectangular groove portion(53). The passing hole(54) is connected with a circular hole(55). The first and the second circular portions(156,256) are inserted into an upper side and a lower side of the passing hole(54). An O-ring(46) is inserted into a groove formed along the second circular portion(256). A flange is combined by inserting an O-ring(46a) into a lower portion of the body(51). A board(48) is combined by inserting the O-ring(46a) into an upper portion of the body(51). A plug assembly(49) is combined with a right side of the body(51).
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申请公布号 |
KR20010090998(A) |
申请公布日期 |
2001.10.22 |
申请号 |
KR20000018607 |
申请日期 |
2000.04.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JANG, YEONG BU;JUNG, CHI HO |
分类号 |
H01L21/316;(IPC1-7):H01L21/316 |
主分类号 |
H01L21/316 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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