PROCEDE D'OBTENTION D'UN MODULE, A HAUTE DENSITE, A PARTIR DE COMPOSANTS ELECTRONIQUES, MODULAIRES, ENCAPSULES ET MODULE AINSI OBTENU

摘要

The invention concerns a method for obtaining a module (4) and the resulting module, based on modular electronic components, encapsulated in flat housings (1A) wherein the elements forming the components are embedded and wherefrom laterally project connecting pins (3A), the housings being stacked and embedded in an insulating block corresponding to at least a module and the connecting pins of the stacked housings being flush at the surface of the block, at one face at least of said block whereon are provided interconnecting strip conductors and/or contacts linking the pins with connection means external to the module. The method consists, prior to stacking the housings, an operation which consists in modifying the connection pins of the housings to reduce their space requirement and an operation reducing the height of the housings by a thinning process performed at their respective bases.