发明名称 SEMICONDUCTOR MEMORY DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To prevent a short-circuit between a bit line and a capacitor lower electrode. SOLUTION: A plug region 106 for electrically connecting a semiconductor substrate 101 is provided between word lines, and a bit line 113 is provided on between the plug regions via a first insulation film and a second insulation film having a small etching rate with respect to the first insulation film, and a capacitor electrode is provided between bit lines via a third insulation film having the small etching rate with respect to the first insulation film, to be connected to the plug regions.
申请公布号 JP2001291846(A) 申请公布日期 2001.10.19
申请号 JP20000108500 申请日期 2000.04.10
申请人 NEC CORP 发明人 TAKADA YUICHI
分类号 H01L21/8242;H01L27/108 主分类号 H01L21/8242
代理机构 代理人
主权项
地址