| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate wherein via holes electrically connected to a sealing metallized layer are made as passed through an insulating layer as a major surface of a substrate and which can realize miniaturization of the substrate, manufacturing ease and via connection reliability simultaneously. SOLUTION: In a sealing metallized layer 104 formed on a major surface 102 of a wiring substrate 100, only parts for via holes 121 for electrical connection with the metallized layer 104 are made wider to form wider parts 107. The other part of the metallized layer is made to have a minimum width necessary for securing a sealing reliability. Bonding pads 105 are formed within a pad formation area 106, while avoiding the wider parts 107.
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