发明名称 CAPILLARY FOR WIRE BONDING
摘要 PROBLEM TO BE SOLVED: To provide a capillary for wire bonding which can realize a bonding which has both a good initial bonding strength and a good heat-proof property with respect to a second bonding. SOLUTION: Basically, the capillary 11 has a cone shape facing downward. In this example, however, the leading edge of the capillary 11 is formed into two stages. The leading edge 12 has a port 14 for leading out a fine wire 13. An edge 15 of the leading-out port 14 is a part for cutting the fine wire 13. The leading edge 12 is also provided with a step-like peripheral region 16, which is located lower than the edge 15. A difference H1 in height between the peripheral region 16 and the edge 15 is smaller at least than the diameter D of the fine wire 13. When the led-out fine wire 13 is cut by rubbing, a part of the fine wire 13 which is near the cut end is simultaneously pressed by the step-like peripheral region 16 and thereby is deformed.
申请公布号 JP2001291736(A) 申请公布日期 2001.10.19
申请号 JP20000104964 申请日期 2000.04.06
申请人 SEIKO EPSON CORP 发明人 KONDO MANABU
分类号 H01L21/60 主分类号 H01L21/60
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