| 摘要 |
PROBLEM TO BE SOLVED: To provide a molded semiconductor laser wherein the top and bottom can be easily discriminated when a molded semiconductor laser in which leads are exposed from the bottom surface is built in a cylindrical holder, and assembling is enabled without troublesome work such as recognition of direction in imperfect assembling or an assembling step. SOLUTION: A submount 7 in which a laser chip 8 and a photodetector 5 for monitoring are arranged is bonded to a die pad 2a of a first lead 2. Electrodes of the laser chip 8 and the photodetector 5 are connected electrically with second leads 3 and 4, respectively, by using wires which are not shown in figure. One end portion in the first and second leads 2-4 is held collectively with a frame body 6 of resin. The first and second leads 2-4 are stretched from the frame body 6 in such a manner that arrangement of the other end portions of the plural leads which are led out from the frame body 6 and stretched becomes asymmetric with respect to the center point. |
