发明名称 LAMINATED WIRING BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a laminated wiring board capable of easily changing the circuit constant. SOLUTION: In a laminated substrate 1 in the four-layer structure, having the top and bottom layers of first and second insulating layers 21 and 22 and laminating first and second dielectric layers 31 and 32 between them, conductor layers 51 and 54 are arranged facing, so as to sandwich the first or second dielectric layer 31 or 32 and three kinds of capacitors 61-63 are formed. Also these respective capacitors 61-63 and surface lands 41-43 formed on a surface 1a of the laminated substrate 1 are connected via a via hole 7. Then, by selecting any one of the surface lands 41-43, desired one of the capacitors 61-63 can be selected.</p>
申请公布号 JP2001291958(A) 申请公布日期 2001.10.19
申请号 JP20000106992 申请日期 2000.04.07
申请人 DENSO CORP 发明人 ASAI YASUTOMI;OKA KENGO;OTA SHINJI
分类号 H05K1/16;H01L23/12;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/16
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