| 摘要 |
<p>PROBLEM TO BE SOLVED: To increase the adhesion between salient electrodes and solder balls in CSP. SOLUTION: Each salient electrode 6 consists of a lower electrode 6a with its upper surface flushed with an upper surface of a sealing film 7 and an upper electrode 6b formed on the lower electrode 6a. The shape in top view of the upper electrode 6b is larger than that of the lower electrode 6a and therefore the surface area of the upper electrode 6b, that is, a bonding area between the upper electrode 6b and the solder ball 24, is larger than an area of the upper surface of the lower electrode 6a.</p> |
