SEMICONDUCTOR MANUFACTURING APPARATUS, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To obtain a semiconductor manufacturing apparatus whereby the uniformity of the processings of semiconductor wafers can be improved. SOLUTION: The semiconductor manufacturing apparatus has a processing furnace 7 for processing semiconductor wafers 12, a pole 8 stood vertically in the processing furnace 7, and holding portions 9, 10, 11 provided horizontally to the pole 8 in a plurality of places disposed in the vertical direction of the pole 8 whereon the semiconductor wafers 12 can be held in a standing way. In the semiconductor manufacturing apparatus, the paired holding portions 9, 10 and the paired holding portions 10, 11 of the respective ones which neighbor respectively on each other in the vertical direction of the pole 8 are so attached to the pole 8 in the different directions from each other that the directions of the parallel planes of the wafers 12 held respectively on them are made different from each other.