发明名称 ELECTRONIC COMPONENT EQUIPPED WITH METAL HOUSING
摘要 PROBLEM TO BE SOLVED: To provide an electronic component equipped with a metal housing accomodating high speed semiconductor elements or electronic circuits, in which unwanted radiation is reduced. SOLUTION: In the electronic component 10, equipped with a metal housing comprising a case 15 and a cover 16 and housing electronic circuits or circuit elements, a magnetic thin film 1 of a magnetic loss material, is provided at least partially on the inner wall face of the metal housing. The magnetic loss material has a composition of M-X-Y (where M is at least one kind among Fe, Co and Ni, X is at least one kind of elements other than M and Y, and Y is at least one kind among F, N and O), where the loss termμ", i.e., the imaginary component of the complex permeability of the magnetic loss material, has a maximum valueμ" max in the frequency range of 100 MHz-10 GHz and the half peak widthμ"50 determined by normalizing the frequency band, where theμ" is not lower than 50% of theμ"max, by the central frequency thereof is within 200%.
申请公布号 JP2001291989(A) 申请公布日期 2001.10.19
申请号 JP20000102467 申请日期 2000.04.04
申请人 TOKIN CORP 发明人 AWAKURA YOSHIO;KAMEI KOJI;SHIRATORI SATOSHI
分类号 H01F10/16;H01F10/00;H01F10/26;H01L23/552;H05K9/00;(IPC1-7):H05K9/00 主分类号 H01F10/16
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