FOREIGN MATTER INSPECTION METHOD, FOREIGN MATTER INSPECTION DEVICE AND ALIGNER USING THAT INSPECTION METHOD

摘要

PROBLEM TO BE SOLVED: To provide a wafer foreign matter inspection method, where a foreign matter which enters between a mask and a wafer and breaks the mask is detected by a PXL aligner and the mask is prevented from being broken, a foreign matter inspection device, and the aligner using that inspection method. SOLUTION: A wafer foreign matter inspection method that a foreign matter inspection device detectable the height of a foreign matter on the peripheral part of a wafer is applied to a PXL aligner, and a foreign matter inspection device and the PXL aligner using that inspection method are used for a detection of the foreign matter and the prevention of a breakage of a mask.