| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing electronic component by which the occurrence of defective resin encapsulation can be prevented. SOLUTION: In this method of manufacturing electronic component constituted by mounting semiconductor chips on a substrate, a die bonding step for mounting the semiconductor chips on the substrate and bonding the chips to a plurality of mounting points of the substrate is performed prior to a resin encapsulation step. When a bad mark is detected from one mounting point as a result of recognizing the mounting points in the die bonding step, the mounting point is discriminated as a defective mounting point, and a defective chip which is discriminated as defective among the semiconductor chips is mounted on the mounting point. In the resin encapsulation step, consequently, the injected quantity of the resin used for the encapsulation can be made uniform by eliminating the occurrence of mold cavities in a state where the chips are not mounted and the occurrence of the defective resin encapsulation can be prevented by preventing the occurrence of defective injections caused by the quantity fluctuation of the resin.
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