| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain high reliability, even under high output oscillation by improving heat dissipation property of a semiconductor laser element in a semiconductor laser device, provided with a semiconductor laser element and a heat sink. SOLUTION: A coolant path, consisting of a substrate groove 1a or the like, whose path wall is at least a part of each of a semiconductor laser element 25 and a heat sink 19 disposed in contact with the semiconductor laser element 25, is formed between them and coolant 28 is made to flow through the coolant path.</p> |
