| 摘要 |
PROBLEM TO BE SOLVED: To increase the reliability of a semiconductor device by preventing peel-off caused by a thermal expansion pressure between a semiconductor element and a dielectric substrate. SOLUTION: A recess 108 for exposure of a second metallic layer 11 of a multilayered wiring substrate is made to form a counter sink 114 with a taper angle at the bottom of the recess. A semiconductor element 106 is mounted on the sink with adhesive 107 such as solder and the recess is filled with bonding resin 5. As a result, the resin 5 is filled even in the sink 114 with the taper angle to prevent peel off of the semiconductor element. |
