| 摘要 |
PROBLEM TO BE SOLVED: To enable an increase in temperature of an IC on a substrate pad even though the temperature of the IC exceeds the temperature endorsed by the maker of the IC and to enable to maintain a state that a solder is melted at adequate levels. SOLUTION: A heat conductive paste (a heat conductive bonding agent) 12 is applied on the upper surface of an IC 11 and thereafter, a heat sink 13 is pressed to the upper surface of the IC 11 making the paste 12 interpose between the heat sink 13 and the IC 11. Subsequently, the paste 12 is hardened in a state that the heat sink 13 is placed on the IC 11, whereby the heat sink 13 is firmly fixed on the IC 11. Subsequently, as mentioned above, the IC 11 with the heat sink 13 fixed on its upper surface is mounted on a substrate 15 and thereafter, the substrate 15 is put in a reflowing furnace. Hereby, a soldering paste printed on a substrate pad is melted and when a semiconductor integrated circuit is mounted on the substrate, heat which is generated by a melting of the soldering paste is propagated to the IC 11 by keeping the heat sink 13 mount on the IC 11, whereby an excessive temperature rise of the IC 11 can be suppressed.
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