发明名称 HIGH FREQUENCY CURRENT SUPPRESSING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a high frequency current suppressing electronic component which suppresses sufficiently a high frequency current and can prevent generation of electromagnetic interference, when the component is used at a high frequency. SOLUTION: This semiconductor integrated circuit element (IC) 1 is used in a high frequency band and operates at a high speed. High frequency current suppressing members 3 which attenuate high frequency currents flowing in terminals 2 themselves are installed to a prescribed number of the terminals 2. The suppressing members 3 are thin film magnetic substance whose thickness is in the range of 0.3-20μm and formed on the whole surface up to end portions including mounting parts to be mounted on a printed wiring circuit board 4 for mounting the IC 1 to the surfaces of the respective terminals 2, and connecting parts to conductive patterns 5 arranged on the board 4. By connecting tip portions with the conductive patterns 5 by using solder 6 when the IC 1 is mounted on the board 4, the vicinity of mounting parts exhibits conductivity in the used frequency band of at most several tens MHz.
申请公布号 JP2001291816(A) 申请公布日期 2001.10.19
申请号 JP20000103025 申请日期 2000.04.05
申请人 TOKIN CORP 发明人 YOSHIDA EIKICHI;KAMEI KOJI;ONO YUJI
分类号 H01F10/14;H01F10/16;H01F27/29;H01L23/00;H01L23/50;(IPC1-7):H01L23/50 主分类号 H01F10/14
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