发明名称 MULTILAYERED CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREFOR, DESIGNING METHOD THEREFOR AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To solve the problem where a warpage occurs on a provided multilayer ceramic substrate since a ticker green layer for substrate is shrunk more noticeably in burning process, when the thickness of each of green layers for substrate is mutually different, although plural green layers for substrate and plural green layers for restraint are laminated concerning a green laminate prepared for providing the multilayered ceramic substrate on the basis of the so-called nonshrink process. SOLUTION: The thickness of each of green layers 12 for a restraint, located in contact with the principal side of each of green layers 11 for substrate, is made to be mutually different. Thus, a green layer 12(c) for the restraint, in contact with a thicker green layer 11(c) for substrate, is made thicker, and a green layer 12(a) for restraint in contact with a thinner green layer 11(a) for substrate is made thinner.
申请公布号 JP2001291955(A) 申请公布日期 2001.10.19
申请号 JP20000107797 申请日期 2000.04.10
申请人 MURATA MFG CO LTD 发明人 NISHIDE MITSUYOSHI;SAKAI NORIO;BABA AKIRA
分类号 C04B41/87;C04B35/64;H01L21/48;H01L23/12;H01L23/498;H05K1/03;H05K3/46 主分类号 C04B41/87
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