发明名称 METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for forming a resist pattern, with which the reciprocal problem between the resolution and the depth of focus can be solved and a microresist pattern be accurately formed at a sufficiently practical depth of focus than a line width which is sufficient to obtain the depth of focus. SOLUTION: A resist pattern 2b with a line width larger than the desired line width is exposed entirely at the quantity of film penetration exposure (e), and after it is heated (f), a soluble part 2c by a developer is developed for five seconds (g) and then it is dissolved and removed, and then a resist pattern 2a with a desired line width is obtained.
申请公布号 JP2001291651(A) 申请公布日期 2001.10.19
申请号 JP20000103368 申请日期 2000.04.05
申请人 NEC CORP 发明人 YAMANA SHINJI
分类号 G03F7/20;G03F7/40;H01L21/027;H01L21/311;H01L21/3213;(IPC1-7):H01L21/027 主分类号 G03F7/20
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