| 摘要 |
PROBLEM TO BE SOLVED: To provide conductor surface treatment for circuit board, with which wet spreading of lead-free solder is improved, when fusing the solder. SOLUTION: An electroless plating layer 5 is formed on a conductor exposing surface 4 of a circuit board, the lead-free solder is stuck on this electroless plating layer 5, and a lead-free solder layer 6 is formed by fusing that lead-free solder.
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