| 摘要 |
PROBLEM TO BE SOLVED: To reliably eliminate an illegal copy and the use of the illegal copy by dicing a semiconductor wafer for producing IC chips. SOLUTION: A pad 20 for I/O data is provided on the outer peripheral part of each IC chip and this pad 20 is constituted of I/O pads 22 for making the delivery and receipt of data between circuit elements 14 provided in the interior of the IC chip and pads 24 for test. The pads 24 are used as pads for inspection to an IC chip adjacent to the IC chip before a semiconductor wafer for producing IC chips is diced. The pads 24 are used as pads for the data input to a block 30 for test control and a block 32 for memory control, which are arranged in the adjacent IC chip. Before the wafer is diced, an internal circuit element of the adjacent IC chip and the pads 24 are connected with each other through wiring layers 40a and 40b. Accordingly, by dicing the wafer, the internal circuit element of the adjacent IC chip and the pads 24 are electrically divided from each other. As the result, not only an illegal copy but also an analysis of the internal circuit element, an analysis of information on secury and the like become impossible.
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